CAS: 4430-09-5; N,N-Dihexylaniline
该化合物是一种有机化合物,被归类为芳香矿;它具有一种附于阴性结构氮原子的六氟基化合物,这助长了其疏水特性;该化合物一般是无色的,可粉色黄色液体,具有典型的探明味;该化合物在水中溶解性相对较低,但在有机溶剂中可溶解,但可溶于有机溶剂,使之在各种应用中有用,包括作为染料,色素和药物合成的中间体;六氟基化合物的存在会增加其脂性,从而影响其在生物系统和环境环境中的行为;N,N-Dihexylaniline还可能表现出中度毒性,在使用过程中需要小心处理和采取适当的安全措施;其化学稳定性和再活性可视环境条件而不同,例如温度和pH.
- 英文名称N,N-Dihexylaniline
- 中文名称N,N-二己基苯胺
- IUPAC名称N,N-dihexylaniline
- 其它别名N,N-Dihexylaniline; Benzenamine, N,N-Dihexyl-; N,N-Di-N-Hexylaniline ; N N-Di-N-Hexylaniline 97; N,N-Di-N-Hexylaniline
- CAS编号4430-09-5
- MFCD编号:MFCD03427070
- EINECS号:626-482-8
- 分子式:C18H31N分子量:261.45
- 产品CID: 2275422
- 产品分类有机原料→分子砌块→芳环类化合物→苯类化合物
物理性质
MSDS等安全信息
欧盟法规
ECHA物质C&L通报上下游产品
CAS号638-45-9 1-碘己烷 | CAS号111-25-1 1-溴代正己烷 | CAS号2305-21-7 反式-2-已烯-1-醇 | CAS号143-16-8 二已胺 | CAS号108-90-7 氯苯 | CAS号4746-32-1 N-己基苯胺 | CAS号111-27-3 正己醇 | CAS号90133-80-5 4-(dihexylamino... | CAS号90134-09-1 N,N-dihexyl-4-i...合成工艺路线路线简述
- 合成目标产物 N N-Di-N-Hexylaniline 97 主要起始原料 P-Toluenesulfonic Acid N-Hexyl Ester And Aniline
- (文献来源)合成步骤主要原料 P-Toluenesulfonic Acid N-Hexyl Ester 和 Aniline
📜苯胺 反应生成 N,N-Di-N-己基苯胺
参考文献:制备一些n-烷基-和nn-二烷基-对亚硝基苯胺
标题:制备一些n-烷基-和nn-二烷基-对亚硝基苯胺
摘要:
DOI:10.1039/jr9550001677
海关参考信息
- 2901100000-饱和无环烃
- 💡 提示：海关信息按照顺序优先匹配，如需确认的海关信息，请参考相关资料。
- 详情请参考：📖 海关编码查询和海关进出口税则
专利信息
专利号:US-8053161-B2
优先权日:2006-09-25
标 题 :Resist composition, resin for use in the resist composition, compound for use in the synthesis of the resin, and pattern-forming method using the resist composition
发明人：WADA KENJI; SAEGUSA HIROSHI
权利人:FUJIFILM CORP
摘要:A resist composition comprises: (A) a resin capable of increasing its solubility in an alkali developer by action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent, wherein the resin (C) has a degree of molecular weight dispersion of 1.3 or less and a weight average molecular weight of 1.0×10 4 or less.
专利号:US-9709891-B2
优先权日:2005-12-09
标 题:Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
发明人：KANDA HIROMI; KANNA SHINICHI
权利人:FUJIFILM CORP
摘要:A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.
专利号:US-8679724-B2
优先权日:2005-12-09
标题 :Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
专利号:US-2008081290-A1
优先权日:2006-09-25
标 题 :Resist composition, resin for use in the resist composition, compound for use in the synthesis of the resin, and pattern-forming method using the resist composition
专利号:US-2007134588-A1
优先权日:2005-12-09
标 题:Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
专利号:US-2014134541-A1
优先权日:2005-12-09
标题 :Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
供应商参考报价(招募中)
品牌试剂参考报价(招募中)
📌 第三方产品分析报告
合成参考文献
参考文献:10.1007/bf02672546
摘要:Cowan JC. Dimer Acids. J Americ Oil Chem Soc. 1962 Dec;39(12):534–45. doi: 10.1007/bf02672546.
📝 需求与反馈
尽可能描述清楚需求与问题信息
