CAS: 105566-68-5; 3,3,12,12-Tetramethoxy-2,13-Dioxa-3,12-Disilatetradecane

相似化合物

87135-01-1 3069-42-9 3069-40-7

上下游产品

trimethoxysilane 1,7-°Ctadiene

📜三甲氧基硅烷,1,7-辛二烯置于十二羰基三钌体系中,用 异丙醇 用作溶剂,化学反应 0.5H,以72%的收率获得1,8-二三甲氧硅基辛烷
参考文献:一种双(烷氧硅基)烷烃的制备方法
标题:一种双(烷氧硅基)烷烃的制备方法
摘要:本发明属于有机合成反应领域,具体涉及采用三烷氧基硅烷与二烯烃为原料制备双(烷氧硅基)烷烃的方法.所述方法包括通式ii化合物和通式iii化合物在溶剂中,经催化剂催化,进行硅氢加成反应获得通式i化合物,所述催化剂为十二羰基三钌,其中,R为c1-C5的烷基,N为4,5,6,7,8,9或10.本发明提供的方法采用常压下反应,具有工艺简单易行,产品纯度高,原料易得,反应温和,反应速度快,原料成本较低等优点,采用十二羰基三钌作为硅氢加成催化,与传统的pt系催化剂相比具有选择性高,价格低廉,合成简单等优点.

专利信息

专利号:US-2010003204-A1
优先权日:2008-07-02
标 题 :Nanoparticle hybrid sunscreens
发明人：LOY DOUGLAS ANSON; SHEA KENNETH J; BODAY DYLAN J; WERTZ JASON T
权利人:ENERGY MATERIALS CORP
摘要:The invention discloses and claims a new class of chemical compositions with ideal sunscreen properties. The chemical composition comprises spherical particles between 200 nm and 10 microns in diameter prepared by an emulsion polymerization of tetraalkoxysilanes or organotrialkoxysilanes or organobridged trialkoxysilanes with a dye monomer bearing two or more alkoxysilyl groups attached to the bridging chromophore. The resulting spheres absorb ultraviolet light. The dye can be any organic chromophore capable of receiving multiple trialkoxysilyl groups resulting in multipoint covalent attachment that precludes leaching of the dye from the spheres. The formic acid-toluene-monomer emulsion polymerization allows for large-scale (>100 gram) synthesis of monodisperse particles under acidic, non-aqueous conditions without surfactants. The particles less than 1 micron in diameter are smooth as talc to the touch and will provide a smooth formulation for sunscreen creams or lotions.

专利号:US-11390746-B2
优先权日:2017-10-27
标 题 :Curable polyorganosiloxane composition, cured body obtained by curing said compositions, and electronic device comprising the same
发明人：OGAWA TAKUYA; PARK YUNGJIN; YOOK JUYOUNG
权利人:DOW SILICONES CORP; DOW TORAY CO LTD
摘要:The present disclosure relates to a light curable, light-heat or light-moisture dually curable, or light-heat-moisture multiple curable polyorganosiloxane composition, which has ease of synthesis, low volatile content, rapid curability, excellent toughness and/or superior optical/physical stability in a variety of fields such as coating materials, encapsulants, sealants and adhesives, a cured body obtained by curing said compositions, and an electronic device comprising the same.